Applied Microengineering Ltd (AML) is an independent private company established in 1992.
AML manufactures unique in-situ aligned wafer bonding machines and provides services based around wafer bonding in its new state-of-the-art multi-million pound £ BONDCENTRE facility situated on UK’s premiere science park in Harwell, Oxfordshire.
AML’s unique Aligned Wafer Bonder machines, the only machines capable of in-situ alignment, activation and bonding on the market, are particularly suited to the bonding requirements of MEMS, IC, & III-V industries. A new upgrade is also now available to allow polymer embossing, imprinting, NIL and other pattern transfer techniques. The machines have the flexibility for R&D and the throughput and automation for volume production as well as the lowest cost of ownership and first class support.
AML’s machines and services are sold worldwide via agents & distributors: China, Hong Kong, USA, India, Israel, Europe, Canada, Japan, Korea, Taiwan, Singapore and Australia.
AML’s comprehensive BONDCENRE provides services from the development of bonding processes to a commercial bonding service – one off to volume. Associated services include CMP, powder blasting, electroplating, screen printing & metrology, a ‘One Stop’ wafer bonding service.
AML’s BONDCENTRE offers the perfect venue for those involved in bonded substrates, device fabrication, 3D integration and wafer level packaging.
AML believes in referrals from its satisfied customers & word of mouth rather than advertising campaigns.
History: AML was the first company formed specifically to exploit MEMS technology or Micro-Nano Technology (MNT) as it is now known. After a number of years designing and producing MEMS devices such as Micro sensors and Microfuidic devices, AML changed direction and now focuses on wafer bonding.