Roth & Rau Microsystems

Roth & Rau Microsystems - Plasma Process and Ion Beam Process Systems

  • Ion Beam Processing Systems

  • Plasma Process Systems

  • Plasma and Ion Beam Sources

  • Customized Equipment


IonSys Series

Flexible Process Systems for advanced Ion Beam Milling & Ion Beam Deposition

IonSys Series - Ion beam milling and deposition

Ion beam techniques have significant advantages to conventional dry etching and deposition techniques including excellent control of process rate, control of ion incident angle, and separate control of ion flow and ion energy. Roth & Rau ion beam systems are equipped with R&R ion beam sources and continuously tilt and rotation-angle adjustable, as well as cooled substrate chucks. In addition, these systems can be fitted with a backside helium contact for efficient heat transfer.





IonScan Series

Ion Beam Systems for ultra precise Film Thickness Correction & Ion Beam Figuring

IonScan Series - Ion beam figuring and film thickness correction

The IonScan technology opens up new possibilities in ultra-precise surface treatment for film-thickness trimming and ion beam figuring in applications ran- ging from semiconductor technology to optics, and from R&D up to high-volume production. IonScan employs a focused ion beam which scans over a sub- strate with precisely controlled position, velocity, and ion beam energy, in order to reduce film thickness and surface contour errors down to the sub-nanometre scale. The excellent performance of the IonScan tech- nology is due to the exceptional stability of the ion beam source, the ingenuity of the scanning profile calculation algorithm, and the ultra-precision of the high-class linear axis system.


MicroSys Series

Flexible Process Systems for Research, Development & small Scale Production

MicroSys - Process systems for R&D and small scale production

The MicroSys platform presents a flexible and cost effective system for reactive ion etching (RIE) and plasma enhanced chemical vapour deposition (PECVD) for single wafers or samples. Various system sizes and a modular adjustable assortment of diff- erent plasma sources and substrate holders that can be cooled or heated allow an optimum adjustment to customer needs. In particular the wide selection of plasma sources provides a specific system design in terms of size, plasma exitation principle and resultant plasma paramaters.






AK Series

Flexible Process Systems for Research, Development & small Scale Production

AK - Process systems for R&D and small scale production

The AK Series is the industry standard for scalable large area plasma process systems. The modular design allows adaptation to several surface treat- ment technologies such as RIE or PECVD. All AK plants us R&R linear microwave plasma sources (LPS) whose operation is based on a partially trans- parent microwave wavegiude. Favourable process homegeneity is gained by scaling the length of the sources and assembling multiple sources in an array. The standard version uses a linear transfer out of a load-lock. Alternatively, multiple process chambers can be operated using a roller track system.


Plasma and Ion Beam Sources

From their own Development as Key Components of the Process Systems

Plasma Source Ion Beam Source

The performance of all process machines depends on the quality of the plasma and ion beam sources used. All sources used in R&R equipment are de- signed and manufactured internally to perfectly match the application and system layout. All plasma and ion beam sources are also available from R&R as separate components.

Plasma Sources: Parrallel Plate Arrangements, Micro- wave and ICP High Frequency Sources.
Cylindrical Broad Beam Ion Sources: Kaufman, RF and Microwave Sources.

AVT Services can assist in the specification of this technology for your process and has fully trained and equipped staff to ensure ongoing support once you have made the commitment to the Roth & Rau brand.

View the Roth & Rau Website for more on their range of ion beam and plasma processing equipment.